File:Bga und via IMGP4531 wp.jpg

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Summary

Description
Deutsch: Schnitt durch ein SDRAM-Modul/-Riegel. Es handelt sich um eine Multilayer-Platine mit aufgelötetem IC in BGA-Technik. Rechts eine Durchkontaktierung (Via). Aufnahme mit Pentax *ist Ds, daran adaptiert ein Minolta Rokkor MC 1.8/35mm HH in Retrostellung an einem Novoflex-Balgengerät. Blende 11, 1/160s, Beleuchtung mit Mecablitz 45CT1 und externem Sensor Mecamat 45-20.
English: Cut through an SDRAM-Module. It is a multi-layer Printed Circuit Board (PCB) with BGA-packaging. On the right side a via.
Français : Coupe d'un circuit imprimé (Mémoire SDRAM) à 4 couches avec un composant de type BGA. A droite est situé un trou traversant métallisé.
Polski: Przekrój przez moduł pamięci SDRAM. Jest to wielowarstwowy obwód drukowany z przylutowanym układem scalonym w obudowie BGA. Po prawej stronie widoczna jest przelotka.
Date
Source Own work
Author Smial

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Image: Rainer Knäpper, Free Art License

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Photo: Rainer Knäpper, Free Art License (http://artlibre.org/licence/lal/en/), https://commons.wikimedia.org/wiki/File:Bga_und_via_IMGP4531_wp.jpg

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16 April 2008

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current20:33, 16 April 2008Thumbnail for version as of 20:33, 16 April 20082,000 × 1,232 (1.16 MB)Smial{{Information |Description={{de|Schnitt durch eine Multilayer-Platine mit aufgelötetem IC in BGA-Technik. Rechts eine Durchkontaktierung (Via)}} |Source=eigene Arbeit |Date=2008-04-16 |Author= Smial |Permission= |other_versions= }} {{GFDL-
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