English: An illustration of the system on a chip (SoC) unit inside Microsoft's game console Xbox 360 S. This part is called XCGPU.
It's a multi chip module, consisting of two chips.
The larger chip is the XCGPU consisting of an "XCPU" processor complex designed by IBM and a "Xenos" graphics processor designed by ATI/AMD and made on a 45 nm fabrication process.
The smaller chip is 10 MB eDRAM manufactured on a 45 nm fabrication process.
This specimen is manufactured by Global Foundries in Singapore and packaged by IBM at their plant in Bromont, Canada.
It was manufactured sometime in 2010.
Inspiration for the image comes from pictures at GiggleHD.com
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