Beth Keser
Beth Keser is an American electronics engineer specializing in electronic packaging, and especially wafer-level packaging. She is head of Packaging & Systems Technology for Intel, and president of the International Microelectronics and Packaging Society.
Education and career[edit]
Keser is originally from Rochester, New York; although her parents were working class, many of her childhood friends were children of engineers.[1][2] She focused on materials science[2] as an undergraduate at Cornell University, graduating in 1993,[3] and earned a Ph.D. in 1997 from the University of Illinois Urbana-Champaign.[3]
After postdoctoral work in a research and development laboratory,[1] she worked on advanced electronic packaging at Motorola for twelve years.[4] In 2009,[3] she became the leader of the Fan-Out and Fan-In Wafer Level Packaging Technology Development and NPI Group for Qualcomm,[4] before moving to her present position at Intel.[1]
She was elected as president of the International Microelectronics and Packaging Society for the 2022–2023 term.[5]
Recognition[edit]
Keser is a Distinguished Lecturer for the IEEE Electronics Packaging Society for 2020–2024.[6] She was named an IEEE Fellow, in the 2020 class of fellows, "for contributions to electronic packaging technologies".[7] In 2021, she received the Exceptional Technical Achievement Award of the IEEE Electronics Packaging Society, with Tanja Braun, "for seminal contributions and leadership in Fan-out Wafer Level Packaging".[8]
She was also one of five winners in a 2015 scriptwriting competition seeking pitches for a television show about a woman engineer, the only engineer to win.[3]
References[edit]
- ^ a b c Guy, Sandra (Spring 2023), "Lateral Career Moves Bring Unexpected Opportunities", SWE, vol. 69, no. 3, Society of Women Engineers, retrieved 2023-05-13
- ^ a b "How I became a techie: Beth Keser", OnQ Blog, Qualcomm, 30 May 2016, retrieved 2023-05-13
- ^ a b c d Karlin, Susan (August 2016), "Profile: Beth Keser - This engineer is MacGyvering a jump to Hollywood", Resources – Careers, IEEE Spectrum, 53 (8): 21, doi:10.1109/mspec.2016.7524163
- ^ a b "Beth Keser", Women in Engineering, University of Illinois Urbana–Champaign Grainger College of Engineering, retrieved 2023-05-14
- ^ Executive Council 2022-2023, International Microelectronics and Packaging Society, retrieved 2023-05-13
- ^ "Distinguished Lecturer Program", Electronics Packaging Society, IEEE, retrieved 2023-05-13
- ^ 2020 Newly Elevated Fellows (PDF), IEEE, retrieved 2023-05-13
- ^ "EPS Exceptional Technical Achievement Award: Past Recipients" (PDF), Electronics Packaging Society, IEEE, retrieved 2023-05-13