Draft:Design Technology Co-optimization

Design Technology Co-optimization (DTCO)

In semiconductor manufacturing, Design Technology Co-Optimization (DTCO) is a holistic methodology that emphasizes the synergistic relationship between integrated circuit (IC) design and fabrication process technology.. DTCO aims to maximize the performance, power efficiency, area (PPA), and cost benefits of advanced semiconductor nodes. This is achieved by breaking down the traditional barriers between design and process development teams, enabling them to collaborate closely and make informed trade-offs throughout the product development cycle.

Background

Historically, semiconductor design and process technology development progressed somewhat independently. Design teams would create circuits using standard cell libraries and design rules provided by the foundries. Foundries, in turn, would focus on developing process technologies that met general transistor scaling and performance targets. While this approach worked well for many years, the increasing complexities at advanced nodes (7nm and below) made this siloed approach less effective.

Key Principles of DTCO

DTCO is guided by the following principles: Category:Key Principles of DTCO

• Early Collaboration: Design and process teams begin collaborating from the very early stages of technology node definition. This allows them to explore potential design choices and process innovations that can lead to the best possible outcomes.
• Iterative Approach: DTCO is not a one-time activity. Teams iterate throughout the development cycle, continuously refining both the design and process technology in response to new data, insights, and constraints.
• Holistic View: DTCO considers not just transistor performance and scaling but also how design choices impact interconnects, variability, reliability, power delivery, and overall system integration.
• Data-driven Decision-Making: DTCO relies heavily on advanced simulation and modeling tools to predict how design choices and process variations will impact the final chip. This allows teams to make informed trade-offs and optimize for the desired metrics.

Examples of DTCO Techniques

DTCO encompasses a wide range of techniques and innovations, including: Category:Examples of DTCO Techniques

• Transistor-level Co-optimization: Designing transistors and standard cells specifically for a given process technology node to maximize performance and density.
• Layout-Aware Process Optimization: Adjusting process steps to improve the manufacturability and yield of specific design structures.
• Design-Aware Variability Modeling: Developing accurate models that predict how design choices influence process variability, allowing designers to mitigate these effects.
• System-Level Power Optimization: Co-optimizing design techniques, process technology, and packaging solutions to achieve the best possible system-level power efficiency.

Benefits of DTCO

• Improved PPA: DTCO leads to chips with better performance, lower power consumption, and smaller die sizes.
• Faster Time-to-Market: The close collaboration enabled by DTCO helps accelerate the development of new semiconductor products.
• Reduced Risk: Through early identification and mitigation of potential issues, DTCO lowers the risk of costly design re-spins.
• Increased Innovation: DTCO fosters a culture of innovation, encouraging teams to explore new and unconventional solutions

Challenges and Future Directions

While highly beneficial, DTCO also presents challenges such as increased complexity, the need for specialized expertise, and the potential for intellectual property concerns. As DTCO continues to mature, foundries and EDA companies are investing in tools and platforms that streamline collaboration and automate many aspects of co-optimization.