User:Jim1138/Sandbox

Double Pulse Laser Machining is a technique using a laser to cut or drill material. The laser cutting cycle uses a double pulse to remove material from the target. The first pulse ablates material from the surface. The second pulse follows a few nanoseconds after the first pulse while the ablated material is in flight. The ejecta absorbs the energy from the second pulse being ejectedprevents the ejecta from redepositing in the hole or channel being cut. The method improves speed, quality, and the with high aspect. ^[1]

References[edit]

^ ""Double-pulse machining as a technique for the enhancement of material removal rates in laser machining of metals"" (PDF). Journal of Applied Physics. Journal of Applied Physics. JoAP 98, 1 (2005). Retrieved 19 August 2009. {{cite web}}: Check date values in: |date= (help)

[1] ""Double-pulse machining as a technique for the enhancement of material removal rates in laser machining of metals"" (PDF). Journal of Applied Physics. Journal of Applied Physics. JoAP 98, 1 (2005). Retrieved 19 August 2009. {{cite web}}: Check date values in: |date= (help)

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