XSON

XSON is a chip package and stands for "plastic eXtremely thin Small OutliNe package".^[1] It's a package where the chip is encapsulated in a block and on the underside the leads are present as strips.

References[edit]

^ "LPC81xM 32-bit ARM Cortex-M0+ microcontroller; up to 16 kB flash and 4 kB SRAM Rev. 4.4 — 23 June 2015 Product data sheet" (PDF). 2015-06-23. p. 3. Retrieved 2016-05-07. plastic extremely thin small outline package; no leads

[1] "LPC81xM 32-bit ARM Cortex-M0+ microcontroller; up to 16 kB flash and 4 kB SRAM Rev. 4.4 — 23 June 2015 Product data sheet" (PDF). 2015-06-23. p. 3. Retrieved 2016-05-07. plastic extremely thin small outline package; no leads

[1]

v t e Semiconductor packages
Single diode	DO-201 (DO-27) DO-204 (DO-7 / DO-26 / DO-35 / DO-41) DO-213 (MELF / SOD-80 / LL34) DO-214 (SMA / SMB / SMC) SOD (SOD-123 / SOD-323 / SOD-523 / SOD-923)
3...5-pin	SOT / TSOT TO-3 (TH / Panel) TO-5 (TH) TO-8 (TH) TO-18 (TH) TO-39 (TH) TO-66 (TH / Panel) TO-92 (TH) TO-126 (TH / Panel) TO-202 (TH / Panel) TO-220 (TH / Panel) TO-247 (TH / Panel) TO-251 (IPAK) (SMT) TO-252 (DPAK) (SMT) TO-262 (I2PAK) (SMT) TO-263 (D2PAK) (SMT) TO-268 (D3PAK) (SMT) TO-273 (Super-220) (SMT) TO-274 (Super-247) (SMT)
Single row	SIP / SIL
Dual row	DFN DIP / DIL Flat Pack MSOP SO / SOIC SOP / SSOP TSOP / HTSOP TSSOP / HTSSOP ZIP
Quad row	LCC QIP / QIL PLCC QFN QFP QUIP / QUIL
Grid array	BGA eWLB LGA PGA
Wafer	COB COF COG CSP Flip Chip PoP QP UICC WL-CSP / WLP
Related topics	Electronic packaging Integrated circuit packaging List of integrated circuit packaging types Printed circuit board Surface-mount technology Through-hole technology
It is relatively common to find packages that contain other components than their designated ones, such as diodes or voltage regulators in transistor packages, etc.