Mini Small Outline Package
The Mini Small Outline Package (MSOP) is a miniaturized version of the small outline integrated circuit packaging format for integrated circuits.
Application[edit]
Many integrated circuits are available in the MSOP form factor. They are suited for space-limited applications requiring 1 mm or less mounted height and are commonly used in disk drives, video/audio and consumer electronics.[1]
Physical properties[edit]
The size of the Mini Small Outline Package is only 3mm × 3mm for the 8 and 10 pin versions[1] and 3mm × 4mm for the 12 and 16 pin version.[2][3] The small package offers a small footprint, short wires for improved electrical connections, and good moisture reliability.[1] Some versions have an exposed pad on the bottom side. The exposed pad will be soldered on the PCB to transfer heat from the package to the PCB.[2][1]
| Part number | Pins | Body width (mm) | Body length (mm) | Lead pitch (mm) |
|---|---|---|---|---|
| MSOP8 | 8 | 3 | 3 | 0.65 |
| MSOP10 | 10 | 3 | 3 | 0.5 |
| MSOP12 | 12 | 3 | 4 | 0.65 |
| MSOP16 | 16 | 3 | 4 | 0.5 |
Synonyms[edit]
- μMAX or micro max - Maxim name for the msop package.[4][2]
- µMAX-EP or micro max exposed pad - Maxim name for the msop package with exposed pad.[2][4]
- MSE - Linear Technology name for the msop package with exposed pad.[2]
See also[edit]
References[edit]
- ^ a b c d "MSOP in STATS ChipPAC datasheet". Retrieved 8 December 2020.
- ^ a b c d e "MSOP on mbedded.ninja". blog.mbedded.ninja. Retrieved 8 December 2020.
- ^ "MSOP on EESemi.com". eesemi.com. Retrieved 8 December 2020.
- ^ a b "Package Information - Maxim Integrated". www.maximintegrated.com. Retrieved 2021-01-04.