Talk:Through-silicon via

Electronics Mid‑importance

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"In truth the co-founder and current CEO of ALLVIA, Inc. coined the term through-silicon via in 1997 as part of his original business plan. From the beginning, the vision of the business plan was to create a through silicon interconnect since these would offer significant performance improvements over wirebonds. "

This statement comes from corporate gimme-money docs. Biased and commercial. Find a better source and cite it. Who the F* is the cofounder of Allvia and why do I care who he is? — Preceding unsigned comment added by 216.67.94.18 (talk) 21:40, 5 September 2012 (UTC)[reply]

Possible Plagiarism in Image Sensors Section[edit]

Significant portions of Through-silicon_via#Image_sensors appear to be plagiarized from the source [1]. I do not have time to fully address the concern right now, but want to flag it for later review. TimberToner (talk) 18:31, 15 June 2023 (UTC)[reply]