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Template:AMD Ryzen AI Mobile 300 series

From Wikipedia, the free encyclopedia

Common features of Ryzen AI 300 notebook APUs:

  • Socket: FP8.
  • All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
  • All the CPUs support 16 PCIe 4.0 lanes.
  • Includes integrated RDNA 3.5 GPU.
  • Includes XDNA 2 AI Engine (Ryzen AI).
  • L1 cache: 80 KB (48 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • Fabrication process: TSMC 4 nm FinFET.
Branding and Model CPU GPU NPU TDP Release
date
Cores
(threads)
Clock (GHz) L3 cache
(total)
Core
config[a]
Model Clock
(GHz)
Base Boost
Ryzen AI 9 HX 370[1] 12 (24) 2.0 5.1 24 MB 4 + 8 890M
16 CUs
2.9 Ryzen AI
Up to 50 TOPS
15–54 W July 17, 2024
365[1] 10 (20) 5.0 4 + 6 880M
12 CUs
Ryzen AI 7 PRO 360[2] 8 (16) 5.1 8 MB 3 + 5 870M TBA TBA TBA TBA
PRO 160[3] 4.2
  1. ^ Core Complexes (CCX) × cores per CCX or Zen 5 + Zen 5c cores