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User:Tegel/Books/SMD2

From Wikipedia, the free encyclopedia
Ball grid array
Integrated circuit
Dual in-line package
Surface-mount technology
Small-outline integrated circuit
Thin small-outline package
Shrink Small-Outline Package
Die (integrated circuit)
Printed circuit board
JEDEC
SMT placement equipment
Chip scale package
Wafer (electronics)
Reflow soldering
Solder
TSSOP
Solder paste
Screen-printing
Soldering
Electronic component
Wave soldering
Through-hole technology
Flip chip
Chip carrier
Flux (metallurgy)
Restriction of Hazardous Substances Directive
Tin
Lead
Whisker (metallurgy)
Electronics