Talk:Adhesive bonding of semiconductor wafers

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Untitled[edit]

Language too technical I find this article too technical to begin to understand the principles involved. In my opinion, the ideas should rendered into a form that is more accessible to the average person. Marty55 (talk) 04:11, 12 February 2014 (UTC)[reply]

Added section on surface preparation of plastics. My hope was to create a useful section related to adhesive bonding that was at a high level for the average person. Gusewelle.2 (talk) 22:54, 23 April 2018 (UTC)[reply]

Draft:Adhesive Bonding[edit]

There is another draft on this subject which should be compared and consolidated with this article. Robert McClenon (talk) 03:50, 12 May 2019 (UTC)[reply]

Robert McClenon, The draft was about the more general topic of adhesive bonding of materials, whereas this article appears to be about the niche application of Adhesive bonding of semiconductor wafers as is specified in the lead sentence. This article is a specialised subset of the general topic of adhesive bonding, and though there would be some overlap in technology, the scope of the two articles is largely different. This article was badly named, possibly by a person unaware that the topic is much broader, which appears to have caused confusion. There are a wide range of applications of adhesive bonding besides wafers. Adhesive bonding has very wide applications and several of them could be potentially stand-alone articles, like this one under the more appropriate title. At a glance, the draft appears well written, though I have not checked references. I suggest that this article is renamed, and the draft brought in to mainspace under this article's title. · · · Peter Southwood ^(talk): 06:01, 28 December 2019 (UTC)[reply]

"Adhesive Bonding (2)" listed at Redirects for discussion[edit]

An editor has asked for a discussion to address the redirect Adhesive Bonding (2). Please participate in the redirect discussion if you wish to do so. Lithopsian (talk) 14:56, 17 February 2020 (UTC)[reply]