Talk:Quad flat package

Electronics Mid‑importance

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Suggest merge[edit]

It would be a more coherent presentation of the subject if all the variants of the quad flat package were described here instead of in many different diverse stubs. The former structure required too much skipping around for too little information. Textbooks discussing IC packaging present all the variants together, often in the same paragraph, instead of a chapter or a book on each one. --Wtshymanski (talk) 23:31, 30 December 2011 (UTC)[reply]

Merged[edit]

This article contains text from the former Low-profile Quad Flat Package, TQFP, PQFP articles. --Wtshymanski (talk) 23:31, 30 December 2011 (UTC)[reply]

References[edit]

Could we find real references from one of the zillion and six books on IC packaging on Google Books, instead of finding data sheets that incidentally mention the package type? We don't care that the Binford 6100 processor came in a triple flat pack with reducing grommets, but a discussion in a book on IC packaging technology would be a better place to learn about packages. --Wtshymanski (talk) 23:34, 30 December 2011 (UTC)[reply]

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