List of semiconductor fabrication plants

From Wikipedia, the free encyclopedia
Jump to: navigation, search

Open[edit]

This is a list of semiconductor fabrication plants:

Company Plant name Plant location Plant cost (in US$ billions) Started production Wafer size (in mm) Process technology node (in nm) Wafer production capacity/month Technology/products
XMC China, Wuhan 300 45-90 22,000 NAND, NOR and CMOS image sensor
ISRO SCL India, Chandigarh 200 180 MEMS, CMOS, CCD, N.S.
Dongbu HiTek Fab1 South Korea, Bucheon 200 150-350 62,000 Analog & Power, Mixed Signal, HV CMOS
Dongbu HiTek Fab2 South Korea, Eumsung, 200 90-180 52,000 Analog & Power, Mixed-Signal, NVM, CIS, High Voltage CMOS, eFlash, sFlash
Silterra Malaysia Fab1 Malaysia, Kedah, Kulim 1.6 2000 200 90-180 28,000–30,000 CMOS, HV, MEMS, RF, Logic, Analog, Mix Signal
Microchip Fab 2 USA, AZ, Tempe 1994 200
Microchip Fab 4 USA, OR, Gresham 2004 200
Microchip Fab 5 USA, CO, Colorado Springs 150
Nanya Fab Taiwan, ? 199x 300 DRAM
Intel D1D[1][2] USA, OR, Hillsboro 2003 300 10 / 14 / 22 Microprocessors[3]
Intel D1C[1][2] USA, OR, Hillsboro 2001 300 14 / 22 / 32 Microprocessors[3]
Intel D1X[4][2] USA, OR, Hillsboro 2013 300 10 / 14 Microprocessors[3]
Intel D1X Module 2[5] 2 2015(planned?) 450(planned?)
Intel Fab 12[1][2] USA, AZ, Chandler 1996 300 22 / 65 Microprocessors & Chipsets[3]
Intel Fab 32[1][6] USA, AZ, Chandler 3 2007 300 45
Intel Fab 32[1][2] USA, AZ, Chandler 2007 300 22 / 32 Microprocessors[3]
Intel Fab 42[7][8][2] USA, AZ, Chandler 5 2020 (plan)[9] 300 7 Microprocessors[3]
Intel Fab 11x[1][2] USA, NM, Rio Rancho 2002 300 32 / 45 Microprocessors[3]
Intel Fab 18[10] Israel, Kiryat Gat 1996 200 65 Microprocessors and chipsets[11]
Intel Fab 10[1] Ireland, Leixlip 1994 200
Intel Fab 14[1] Ireland, Leixlip 1998 200
Intel Fab 24[1][2] Ireland, Leixlip 2004 300 14 / 65 / 90[12] Microprocessors, Chipsets and Comms[3]
Intel Fab 28[1][2] Israel, Kiryat Gat 2008 300 22 / 45 Microprocessors[3]
Intel Fab 68[1][13] China, Dalian 2.5 2010 300 65[14] VNAND[3]
TowerJazz (former Maxim) San Antonio [15][16] USA, TX, San Antonio 2003 200 180 Al BEOL, Power, RF Analog
Apple (formerly Maxim, formerly Samsung) X3[17] USA, CA, San Jose ?, 1997, 2015[18]
Maxim MaxFabNorth[19] USA, OR, Beaverton
Mikron Russia, Zelenograd 90-180
VSP Mikron WaferFab[20] Russia, Voronezh 1959 100/150 900+ 6000 Analog, power
NXP Semiconductors(Former Freescale Semiconductor)(Former Motorola) MOTOFAB1[21] Mexico, Guadalajara 2002
Micron Fab 1 USA, VA, Manassas 1981 300 DRAM
Micron Fab 2 Taiwan[22][23] 300 25[24] 70,000 DRAM
Micron Fab 6 USA, VA, Manassas 300 25[24] 70,000 DRAM, NAND FLASH, NOR
Micron Fab 4[25] USA, ID, Boise 300 RnD
Micron Fab 13[26] Singapore, Singapore 200 NOR
Micron Fab 10[27] Singapore, Singapore 300 100,000 NAND FLASH
Micron Fab 7 (former TECH Semiconductor, Singapore)[28] Singapore, Singapore 300 60,000 NAND FLASH
Micron Fab 15 (former Elpida Memory, Hiroshima)[25] Japan, Hiroshima 300 20 and under 100,000 DRAM
Micron Fab 16 (former Rexchip, Taichung)[25] Taiwan, Taichung 300 30 and under 80,000 DRAM
Micron Fab 11 (former Inotera)[29] Taiwan, Taoyuan 300 20 and under 80,000 DRAM
GlobalFoundries Fab 9 USA, VT, Essex Junction 200 90–350 40,000
GlobalFoundries Fab 10 USA, NY, East Fishkill 2.5 2002 300 2290 14,000
GlobalFoundries Fab 1[30] Germany, Dresden 2.5, 7(Total) 2005 300 2845 80,000 Foundry
GlobalFoundries Fab 7[30] Singapore 300 40, 90, 65, 130 50,000 Bulk CMOS, SoI
GlobalFoundries Fab 8[30] USA, NY, Malta 4.6 2012 300 14 / 22 / 28 60,000 High-K Metal Gate[31]
GlobalFoundries Fab 2[32] Singapore 200 350–600 50,000
GlobalFoundries Fab 3/5[32] Singapore 200 180–350 54,000
GlobalFoundries Fab 3E[32] Singapore 200 180 34,000
GlobalFoundries Fab 6[32] Singapore 200 110–180 45,000
Hindustan Semiconductor Manufacturing India, Gujarat 6 300 14 20,000
Toshiba Yokkaichi Operations[33][34] Japan, Yokkaichi 1992 Flash Memory
Toshiba/SanDisk Fab 5 Phase 1(at Yokkaichi Operations) Japan, 800 Yamanoisshikicho, Yokkaichi, Mie[35] 2011 Flash
Toshiba/SanDisk Fab 5 Phase 2[35](at Yokkaichi Operations) Japan, Mie 2011 300 15[36] Flash
Toshiba[37] Fab 3(at Yokkaichi Operations) Japan, Yokkaichi NAND Memory
Toshiba[38] Fab 4(at Yokkaichi Operations) Japan, Yokkaichi 2007 NAND Memory
Toshiba[39] Kaga Toshiba Japan, Ishikawa Power Semiconductor devices
Toshiba[40] Oita Operations Japan, Kyushu
Toshiba[41][42] Fab 6(phase 1)(at Yokkaichi Operations)[43] Japan, Yokkaichi 1.6, 1.7, 1.8(Estimates)(Combined costs of installation of equipment at Phase 1 and construction of Phase 2)[44][34] 2018, Summer; Cleanroom is being equipped BiCS FLASH™
Toshiba[41][42] Fab 6(phase 2)(at Yokkaichi Operations) Japan, Yokkaichi 1.6, 1.7, 1.8(Estimates)(Combined costs of installation of equipment at Phase 1 and construction of Phase 2)[44][34] Planned BiCS FLASH™
Toshiba[41] Fab 2(at Yokkaichi Operations) Japan, Yokkaichi 1995 3D NAND
Toshiba[45][46] New Fab 2(at Yokkaichi Operations) Japan, Yokkaichi 2016, July 15 3D NAND
Hitachi[47] Rinkai Factory Japan, 5-2-2, Omikacho, Hitachi-shi, Ibaraki, 319-1221 MEMS Foundry
Hitachi[47] Haramachi Factory Japan, 20 Aza Oohara, Shimo-Ota, Haramachi-ku, Minamisouma-shi, Fukushima, 975-0041 Power Semiconductors
Hitachi[47] Yamanashi Factory Japan, 545, Itchohata, Chuo-shi, Yamanashi, 409-3813 Power Semiconductors
TSMC Fab 2[48] Taiwan, Hsinchu 150 44,000[49] Foundry
TSMC Fab 3 Taiwan, Hsinchu 200
TSMC Fab 5 Taiwan, Hsinchu 200
TSMC Fab 6 Taiwan, Tainan 2.4 2000, January; 2001[50] 200, 300 180-? 50,000 Foundry
TSMC Fab 7[51] Taiwan, Tainan 200
TSMC Fab 8 Taiwan, Hsinchu 200
TSMC Fab 10 China, Shanghai 200
TSMC Fab 12 Taiwan, Hsinchu 2 [52] 300 150-28 25,000[50]
TSMC Fab 12A Taiwan, Hsinchu 300 25,000
TSMC Fab 12B Taiwan, Hsinchu 300 25,000
TSMC Fab 12(P4) Taiwan, Hsinchu 300 20 25,000
TSMC Fab 12(P6) Taiwan, Hsinchu 300 16 25,000
TSMC Fab 12(P7) Taiwan, Hsinchu (future) 300 16
TSMC Fab 14 Taiwan, Tainan 2002[50] 300 20 50,000+
TSMC Fab 14(B) Taiwan, Tainan 300 16 50,000+[53]
TSMC WaferTech Fab 11 USA, WA, Camas 200
TSMC Fab 15[54] Taiwan, Taichung 9.3 2011 300 20 100,000+(166,000 estimate)[55][53]
TSMC Fab 15(B) Taiwan, Taichung (future) 300 10
TSMC[56] NJ China, Nanjing Under Construction 300 20,000
TSMC(former WSMC)[57] 200
TSMC(former TASMC)(former Acer Semiconductor Manufacturing Inc. Now ALi Corporation)(former Texas Instruments)[58][59][60] 200 DRAM(former), Logic(former), Foundry(current)
UMC Fab 6A Taiwan, Hsinchu 150
UMC Fab 8AB Taiwan, Hsinchu 200
UMC Fab 8C Taiwan, Hsinchu 200
UMC Fab 8D Taiwan, Hsinchu 200
UMC Fab 8E Taiwan, Hsinchu 200
UMC Fab 8F Taiwan, Hsinchu 200
UMC Fab 8S Taiwan, Hsinchu 200
UMC Fab 12A Taiwan, Tainan 300 55,000
UMC Fab 12i Singapore 300 45,000
UMC Japan[50][61] 300 180-?
Vanguard International Semiconductor Fab 1 Taiwan, Hsinchu 200
Vanguard International Semiconductor Fab 2 Taiwan, Hsinchu 200
IM Flash IM Flash[62] Singapore 2011 300 25
IM Flash IM Flash USA, UT, Lehi 300 20
IM Flash IM Flash USA, VA, Manassas
NXP Semiconductors ATMC[63] USA, TX, Austin 1995 200 90
NXP Semiconductors Chandler Fab[64] USA, AZ, Chandler 1.1[65] 1993 200 180
NXP Semiconductors Oak Hill Fab[66] USA, TX, Austin .8[67] 1991 200 250
Nexperia Hamburg site[68] Germany, Hamburg 1953 200 35,000 Small-signal and bipolar discrete devices
Nexperia Manchester[68] UK, Bramhall Moor Lane, Pepper Rd, Hazel Grove, Stockport SK7 5BJ 1987? 150 24,000 TrenchMOS MOSFETs
NXP Semiconductors China, Jilin
NXP Semiconductors UK, Manchester
NXP Semiconductors ICN8 Netherlands, Nijmegen
NXP Semiconductors SSMC Singapore
X-Fab France SAS(former Altis Semiconductor)(Former IBM)[69] ACL-AMF France, Corbeil-Essonnes 1991 200 130–350 CMOS
LFoundry (de) (former Micron)[70] Italy, Avezzano 1995 200 90–150 40,000
Raytheon Systems Ltd UK, Glenrothes, Scotland 1960 100 CMOS on SiC
STMicroelectronics AMK8 (second, newer fab) Singapore, Ang Mo Kio 1995 200
STMicroelectronics AMJ9 (first fab, initially owned by SGS Microelettronica) Singapore, Ang Mo Kio 1984[71] 150
STMicroelectronics Crolles 1 / Crolles 200 France, Crolles 1993 200
STMicroelectronics Crolles2 / Crolles 300 France, Crolles 2003 300 90, 65, 45, 32
STMicroelectronics Tours France, Tours 200
STMicroelectronics (formerly SGS-ATES) R2 (upgraded in 2001 from R1) Italy, Agrate Brianza 1963 200
STMicroelectronics (formerly SGS-ATES) AG8/AGM Italy, Agrate Brianza 1963 200
STMicroelectronics Catania Italy, Catania 1997 200
STMicroelectronics Rousset France, Rousset 2000 200
SUNY Poly CNSE NanoFab 300 North[72] USA, NY, Albany .175, .050 2004, 2005 300 65, 45, 32, 22
SUNY Poly CNSE NanoFab 200[73] USA, NY, Albany .016 1997 200
SUNY Poly CNSE NanoFab Central[72] USA, NY, Albany .150 2009 300 22
Powerchip Semiconductor Memory Foundry, Fab P1[74][75] Taiwan, Hsinchu 300 90, 70, 22[76] 80,000 Memory IC, LCD drive IC, Integrated Memory Chips, CMOS Image Sensors, and Power Management IC
Powerchip Semiconductor Fab P2[75] Taiwan, Hsinchu, Hsinchu Science Park 300 90, 70, 22[77] 80,000 Memory IC, LCD drive IC, Integrated Memory Chips, CMOS Image Sensors, and Power Management IC
Powerchip Semiconductor Fab P3[75] Taiwan, Hsinchu, Hsinchu Science Park 300 90, 70, 22[78] 20,000 Memory IC, LCD drive IC, Integrated Memory Chips, CMOS Image Sensors, and Power Management IC
Fairchild Semiconductor(Now ON Semiconductor) USA, PA, Mountain Top 1960/1997 200 350
Fairchild Semiconductor(Now ON Semiconductor) USA, ME, South Portland 1960/1997 200 350
SMIC S1 Mega Fab (S1A/S1B/S1C)[79] China, Shanghai 200 350-90 114,000[80]
SMIC S2 (Fab 8)[79] China, Shanghai 300 45/40-32/28 20,000[80]
SMIC SN1[79] China, Shanghai (plan) 300 70,000[81]
SMIC B1 Mega Fab (Fab 4, Fab 6)[79] China, Beijing 2004 300 180-90/55 50,000[80]
SMIC B2A[79] China, Beijing 3.59[82] 2014 300 45/40-32/28 35,000[80]
SMIC Fab 7[79] China, Tianjin 2004 200 350-90 47,000[80]
SMIC Fab 15[79] China, Shenzhen 2014 200 350-90 50,000[80]
SMIC SZ (Fab 16A/B)[79] China, Shenzhen Planned) 300 40,000[81]
SMIC[83] B3 China, Beijing Under Construction 300 35,000
Winbond Memory Product Foundry[84] Taiwan, Taichung 300 46
Winbond CTSP Site [85][86] Taiwan, No. 8, Keya 1st Rd.,Daya Dist.,Central Taiwan Science Park, Taichung City 42881
MagnaChip F-5[87] South Korea, Cheongju 2005 200 130
ProMOS Fab 4[88][89] Taiwan, Taichung 1.6 300 70
TSI Semiconductors Heilbronn Germany, Heilbronn 150 10,000
TSI Semiconductors[90] Roseville fab[91] USA, CA, Roseville 200
SK Hynix[92] China, Chongqing
SK Hynix[93][94] South Korea, Cheongju, Chungcheongbuk-do Under Construction NAND Flash
SK Hynix[94] South Korea, Cheongju Under Construction NAND Flash
SK Hynix[94] South Korea, Incheon Planned NAND Flash
SK Hynix M8 South Korea, Cheongju 200 Foundry
SK Hynix M10 South Korea, Icheon 300 DRAM
SK Hynix M11 South Korea, Cheongju 300 NAND Flash
SK Hynix M12 South Korea, Cheongju 300 NAND Flash
SK Hynix HC1 China, Wuxi 300 100,000[81] DRAM
SK Hynix HC2 China, Wuxi 300 70,000[81] DRAM
SK Hynix M14 South Korea, Icheon 300 DRAM, NAND Flash
CSMC [95] China, Wuxi 200-300 130-above
Fujitsu Mie(original installations)[96] Japan, Mie 1974 150, 200, 300[97]
Mie Fujitsu Semiconductor Limited[98][99] Fab B1(at Mie)[100] Japan, 1500 Tadocho Mizono, Kuwana, Mie[101] 2005 300 65, 90 15,000 Foundry, Ultra-low Power ICs, Embedded Memory, RF ICs
Mie Fujitsu Semconductor Limited[102][99] Fab B2(at Mie)[100] Japan, 1500 Tadocho Mizono, Kuwana, Mie[101] 1(total)[103] 2007, July 300 65, 90 25,000 Foundry, Ultra-low Power ICs, Embedded Memory, RF ICs[104]
Mie Fujitsu Semconductor Limited[105][99] Japan, 1500 Tadocho Mizono, Kuwana, Mie[101] 2015 300 40[106] 5,000 Foundry
Fujitsu Kumagaya Plant[100] Japan, Saitama, 1224 Oaza-Nakanara, Kumagaya-shi, 360-0801 1974
Fujitsu[107] Suzaka Plant Japan, Nagano, 460 Oaza-Koyama, Suzaka-shi, 382-8501
Fujitsu Iwate Plant [108][97] Japan, Iwate, 4-2 Nishinemoriyama, Kanegasaki-cho, Isawa-gun, 029-4593
Aizu Fujitsu Semiconductor[109] Aizu Wakamatsu Plant [110] Japan, Fukushima, 3 Kogyo Danchi, Monden-machi, Aizuwakamatsu-shi, 965-8502 150, 200[111][112] Memory, Logic
Micronas FREIBURG [113][114] Hans-Bunte-Strasse Germany, Freiburg, 19 D-79108]
Cypress Semiconductor Minnesota fab USA, MN, Bloomington 1991 65, 90, 130, 180, 250, 350
Cypress Semiconductor Fab25 USA, TX, Austin 1994 200 Flash / Logic
ON Semiconductor Gresham[115] USA, OR, Gresham 200 110
ON Semiconductor (former AMI Semiconductor) Pocatello[116] USA, ID, Pocatello 200 350
ON Semiconductor Oudenaarde Belgium, Oudenaarde 150 350 4,000
ON Semiconductor ISMF Malaysia, Seremban 150 350 80,000 Discrete
ON Semiconductor Niigata Japan, Niigata 150 350
ON Semiconductor Roznov Czech Republic, Roznov 150 5000
Texas Instruments (former National Semiconductor) South Portland[117] USA, ME, South Portland .932 1997 350, 250, 180
Samsung S3-Line[118] South Korea, Hwaseong 10.2, 16.2(planned)[119] Under construction 300 20 200,000 DRAM, VNAND
Samsung S2-Line[120] USA, TX, Austin 0.260[121] 2011 300 14 62,000 Microprocessors
Samsung S1-Line[122] South Korea, Giheung 33 (total) 2005(second phase), 1983(first phase)[123][124] 300 14 62,000 Microprocessors, S.LSI, LEDs [125]
Samsung Pyeongtaek[126][127] South Korea, Pyeongtaek 14.7, 27(total)[128][129][130] 2017, July 6 300 14 450,000[131] V-NAND, DRAM(planned)
Samsung Samsung China Semiconductor[132] China, Shaanxi Province DDR Memory
Samsung Samsung Suzhou Research Center (SSCR)[122] Suzhou Industrial Park, Suzhou, China DDR Memory
Samsung Onyang Complex[132] South Korea, Chungcheongnam-do DDR Memory, System Logic
Samsung F1x1[133] China, Xian 2.3[134] 2014(first phase, second phase is under review)[119] 300 20 100,000 VNAND
Samsung Giheung Campus[135] South Korea, Gyeonggi-do, Yongin LEDs
Samsung Hwasung Campus[135] South Korea, Gyeonggi-do, Hwaseong LEDs
Samsung Tianjin Samsung LED Co., Ltd.[135] China, Tianjin, Xiqing, Micro-Electronic Industrial Park, Weisi Road LEDs
Samsung Samsung Suzhou LCD (SSL)[136] China, Jiangsu Province, Suzhou Industry Park, Fengli Street AMOLEDs[137]
Samsung[119] South Korea, Asan 2018 (planned) OLEDs
Samsung A3[138] South Korea, Asan? 135,000 Flexible OLEDs
Samsung A5[138] South Korea, Cheonan? Under Construction 180,000-270,000 AMOLEDs
Samsung A4[138] South Korea, Asan? 45,000 (planned, by the end of 2018) AMOLEDs
Samsung A1[138][136] South Korea, Asan 55,000 Rigid OLEDs
Samsung A2[138][136] South Korea, Asan 180,000 Flexible OLEDs
TowerJazz Fab 1[139] Israel, Migdal Haemek 1989 150 1000-350 Planarized BEOL, W and Oxide CMP, CMOS, CIS, Power, Power Discrete
TowerJazz Fab 2[139] Israel, Migdal Haemek 2003 200 180-130 Cu and Al BEOL, EPI, 193 nm Scanner, CMOS, CIS, Power, Power Discrete, MEMS, RFCMOS
TowerJazz Fab 3[139] USA, CA, Newport Beach 1967 200 130–500 Al BEOL, SiGe, EPI
TowerJazzTPSCo Fab 5,[139] Tonami[140] Japan, Tonami 1994 200 500-130 Analog/Mixed-Signal,Power,Discrete,NVM,CCD
TowerJazzTPSCo Fab 7,[139] Uozu[140] Japan, Uozu 1984 300 65. 45 CMOS,CIS,RF,SOI, Analog/Mixed-Signal
TowerJazzTPSCo Fab 6,[139] Arai[140] Japan, Arai 1976 200 130-110 Analog/Mixed-Signal,CIS,NVM,Thick Cu RDL
TowerJazz China, Nanjing[141][142] 200, 300(plan)
Texas Instruments FFAB Germany, Freising 200
Texas Instruments MFAB USA, ME, ? 200
Texas Instruments RFAB USA, TX, Richardson 2009 300
Texas Instruments DMOS6 USA, TX, Dallas 300
Texas Instruments DMOS5 USA, TX, Dallas 200
Texas Instruments DFAB USA, TX, Dallas 1964 150/200
Texas Instruments SFAB USA, TX, Sherman 150
Texas Instruments GFAB UK, Scotland, Greenock 150/200 40,000
Texas Instruments MIHO8 Japan, Miho 200
Texas Instruments Aizu Japan, Aizu 200
Texas Instruments Chengdu (CFAB) China, Chengdu 200
General Motors Components Holdings Fab III USA, IN, Kokomo 125/200 500+
Infineon Technologies Villach Austria, Villach 1970[143] 100/150/200/300 MEMS, SiC, GaN
Infineon Technologies Dresden Germany, Dresden 1994/2011[144] 200/300 90
Infineon Technologies Kulim[145] Malaysia, Kulim 2006[146] 200/300 50,000
Infineon Technologies Kulim 2 Malaysia, Kulim 2015 200/300 50,000
Infineon Technologies Regensburg[147] Germany, Regensburg 1959
Bosch Germany, Reutlingen 1995[148] 150 ASIC, analog, power
Bosch Germany, Dresden
Bosch WaferFab Germany, Reutlingen 0.708[149] 2010[148] 200 30,000 ASIC, analog, power, MEMS
Analog Devices Limerick Ireland, Limerick 200
Analog Devices Wilmington USA, MA, Wilmington 200/150
Analog Devices (formerly Linear Technology) Hillview USA, CA, Milipitas 150
Analog Devices (formerly Linear Technology) Camas USA, WA, Camas 150
X-Fab Erfurt Germany, Erfurt 200[150] 600–1000[150] 11200–[150]
X-Fab Dresden Germany, Dresden 200[151] 350–1000[151] 6000–[151]
X-Fab Itzehoe Germany, Itzehoe 200[152] 13000–[152] MEMS
X-Fab Kuching Malaysia, Kuching 200[153] 130–350[153] 27000–[153]
X-Fab Lubbock USA, TX, Lubbock 200[154] 600–1000[154] 15000–[154]
Teledyne DALSA Teledyne DALSA Semiconductor Canada, Bromont, QC 1980 150/200 HV ASICs, HV CMOS, MEMS, CCD
Unitec Blue[155] Argentina, Chascomús 1.2[156]
ams[157] FAB B Austria, Unterpremstaetten 200 350
HuahongGrace[158] FAB China, Shanghai 300 90
ASMC[159] FAB 1/2 China, Shanghai 200 600 BCD, HV
ASMC[159] FAB 3 China, Shanghai 200 250
Beilling[160] China, Shanghai 150 1200 BiCMOS, CMOS
Diodes Incorporated[161] OFAB UK, Oldham 150
Diodes Incorporated[161] KFAB USA, MO, Lee's Summit
Polar Semiconductor[162] FAB1 USA, MN, Bloomington 150 BCD, HV
Polar Semiconductor[162] FAB2 USA, MN, Bloomington 200 BCD, HV, GMR
Sony[163] Kagoshima Technology Center Japan, Kagoshima 1973 Bipolar CCD, MOS, MMIC, SXRD
Sony[163] Oita Technology Center Japan, Oita 2016 CMOS Image Sensor
Sony[163] Nagasaki Technology Center Japan, Nagasaki 1987 MOS LSI, CMOS Image Sensors, SXRD
Sony[163] Kumamoto Technology Center Japan, Kumamoto 2001 CCD Imgage Sensors, H-LCD, SXRD
Sony[163] Shiroishi Zao Technology Center Japan, Shiroishi 1969 Semiconductor Lasers
Sony[163] Higashiura Japan, Aichi OLED Displays
Sony(Former Renesas)(Former NEC Electronics)(former NEC)[163][164][165] Yamagata Technology Center Japan, Yamagata 2014 CMOS Image Sensor, eDRAM(former)
Renesas[166] Renesas Semiconductor (Beijing) Co., Ltd. China, Haidian District, Beijing 100085
Renesas[166] Renesas Semiconductor (Suzhou) Co., Ltd. China, No.176, Zhongxin Avenue West, Suzhou Industrial Park, Suzhou 215021
Renesas[166] Renesas Semiconductor (Malaysia) Sdn. Bhd. Malaysia, Bayan Lepas Free Industrial Zone, 11900 Penang
Renesas[166] Renesas Semiconductor (Kedah) Sdn. Bhd. Malaysia, Kulim Industrial Estate, 09000 Kulim, Kedah
Renesas[166] Renesas Semiconductor KL Sdn. Bhd. Malaysia, KM 15, Jalan Banting, 42500 Telok Panglima Garang, Selangor Darul Ehsan
Renesas[166] Renesas Semiconductor Manufacturing Co., Ltd. Japan, 751, Horiguchi, Hitachinaka-shi, Ibaraki, 312-8504
Renesas-Intersil[166] USA, CA, Milpitas, 1 Murphy Ranch Rd
LG Innotek [167] Paju South Korea, 570, Hyuam-ro, Munsan-eup, Paju-si, Gyeonggi-do, 10842 LED Epi-wafer, Chip, Package
Macronix[168] Fab 5 300 50,000
Macronix[168] Fab 2 200 48,000
Macronix[168] Fab 1 150 40,000
Nuvoton[169] Fab2 Taiwan 150 350-1000 nm Generic Logic, Mixed Signal (Mixed Mode), High Voltage, Ultra High Voltage, Power Management, Mask ROM (Flat Cell), Embedded Logic, Non-Volatile Memory, IGBT, MOSFET, Biochip, TVS, Sensor
Nuvoton Nuvoton Technology Corporation Taiwan, No. 4, Creation Rd. III, Hsinchu Science Park
Mitsumi Electric[170] Semiconductor Works #3 Japan, Atsugi Operation Base 2000
Mitsumi Electric[170] Japan, Atsugi Operation Base 1979
Rohm[171] Shiga Factory Japan 200 150 IGBT, MOSFET, MEMS
Rohm(Lapis Semiconductor)[172] Miyasaki Japan 150 MEMS
Rohm(Kionix)[173] Ithaca Ithaca, NY, USA 150 MEMS
Rohm(Kionix)[173] Kyoto Japan, Kyoto 200 MEMS
Fuji Electric[174] Omachi Japan, Nagano Prefecture
Fuji Electric[175] Iyama Japan, Nagano Prefecture
Fuji Electric[176] Hokuriku Japan, Toyama prefecture
Fuji Electric[177] Matsumoto Japan, Nagano prefecture
Murata Manufacturing[178] Kanazawa Japan
Murata Manufacturing[179][180] Sendai Japan, Miyagi Prefecture MEMS[181]
Murata Manufacturing[179] Yamanashi Japan, Yamanashi Prefecture
Murata Manufacturing[182] Yasu Japan, Yasu, Shiga Prefecture
Olympus Corporation[183] Nagano Japan, Nagano Prefecture MEMS[184]
Micron Semiconductor Ltd. [185] Lancing UK, West Sussex, Lancing Detectors
D-Wave Systems [186] Superconducting Foundry[187] Quantum Processing Units(QPUs)[187]
Mitsubishi Electric [188] Power Device Works, Kunamoto Site Japan Power Semiconductors
Mitsubishi Electric [188] Power Device Works, Fukuoka Site Japan, Kunamoto Prefecture, Fukuoka City[189] Power Semiconductors and sensors[189]
Mitsubishi Electric [190] High frequency optical device manufacturing plant Japan, Hyogo Prefecture[191] High frequency semiconductor devices(GaAsFET, GaN, MMIC)[192]
SiSemi[193] China, Shenzhen, Longgang High-tech Industrial Park[194] 130 Power Semiconductors, LED Drivers, Bipolar Power Transistors, Power MOSFETs
SiSemi[194] 100 Transistors
Xinxin[195] F1 China, Wuhan 300 20,000
Huali[196][197] F1 China, Shanghai 300 193, 55, 40, 28[198] 35,000 Foundry
Huali[199] F2 China, Shanghai Under Construction 300 40,000
Jinghe[200] HF China, Hefei Under Construction 300 40,000
Jinhua[201] F2 China, Quanzhou Under Construction 300 60,000
United Chip[202] Fab 12x China, Xiamen Under Construction 300 50,000
Uni Group[203] SZ China, Shenzhen Under Construction 300 50,000
Xinxin[204] F2 China, Wuhan Under Construction 300 200,000
Decoma[205] F2 China, Huaian Under Construction 300 20,000
Wandai[206] CQ China, Chongqing Under Construction 300 20,000
Cree Inc.[207] Durham USA, NC, Durham Compound Semiconductors, LEDs
Cree Inc.[208] Research Triangle Park USA, NC GaN HEMT RF ICs
Renesas(Former NEC Electronics)(Former NEC Roseville[209][210] USA, CA, Roseville 1.2[211] 2002, April 200 RAM, SoCs, Multimedia Chips
Denso Denso Iwate[212][213][214] Japan, Iwate Prefecture, Kanegasaki-cho 0.088 Under construction, 2019, May(planned) Semiconductor wafers and Sensors(since June 2017)
Rigetti Computing Fab-1[215][216][217] USA, CA, Freemont 130 Quantum Processors
Flir Systems USA, CA, Santa Barbara[218] 150 IR Detectors, Thermal Imaging Sensors
Rogue Valley Microdevices USA, OR, Medford 2003 150  MEMS foundry 
New Japan Radio Kawagoe Works Japan, Saitama Prefecture, Fujimino City[219][220] 100, 150 4000, 400, 350 Bipolar, Mixed Signal, Analog, Hi Speed BiCMOS, BCD, 40V Hi Speed Complementary Bipolar, Analog CMOS+HV,

SAW Filters[221]

New Japan Radio Saga Electronics[222] Japan, Saga Prefecture 100, 150 4000, 400, 350[223] Foundry, Bipolar, Mixed Signal, Analog, Hi Speed BiCMOS, BCD, 40V Hi Speed Complementary Bipolar, Analog CMOS+HV,

SAW Filters[221]

New Japan Radio NJR FUKUOKA Japan, Fukuoka Prefecture, Fukuoka City[224] 2003[225] 100, 150 Bipolar, Analog ICs, MOSFETs LSI, BiCMOS ICs
New Japan Radio Japan, Nagano, Nagano City[226]
New Japan Radio Japan, Nagano, Ueda City[227]
ABB[228] Lenzburg Switzerland, Lenzburg 0.140 2010(2nd Phase) 18,750(225,000 per year) High power Semiconductors
Noel Technologies[229] 450-51[230][229] 500-250[231]
Skyworks Solutions[232] USA, CA Compound Semiconductors
Skyworks Solutions[232] Japan, Osaka SAW, TC-SAW Filters
Skyworks Solutions[232] USA, Woburn MA RF/cellular components (SiGe)
Skyworks Solutions[232] Japan, Kadoma SAW, TC-SAW Filters
Skyworks Solutions[232] Singapore, Bedok South Road SAW, TC-SAW Filters
Seiko Instruments Inc.[233] China, Shanghai
Seiko Instruments Inc.[233] Japan, Akita
Seiko Instruments Inc.[233] Japan, Takatsuka
Lite-On Optoelectronics[234] China, Tianjin
Lite-On Optoelectronics[234] Thailand, Bangkok
Lite-On Optoelectronics[234] China, Jiangsu
Lite-On Semiconductor[235] Keelung Plant Taiwan, Keelung 1990 100 Thystors, DIscrete
Lite-On Semiconductor[235] Hsinchu Plant Taiwan, Hsinchu 2005 Bipolar BCD, CMOS
Lite-On Semiconductor[235] Lite-On Semi(Wuxi) China, Jiangsu 2004 100 Discrete
Lite-On Semiconductor[235] Wuxi WMEC Plant China, Jiangsu 2005 Discrete, Power, Optical ICs
Lite-On Semiconductor[235] Shanghai (SSEC) Plant China, Shanghai 1993 76 Fab, Assembly
Creative Sensor Inc.[236][237] NanChang Creative Sensor China, Jiangxi 2007 Image Sensors
Creative Sensor Inc.[236] Wuxi Creative Sensor China, JiangSu 2002
Creative Sensor Inc.[236] Wuxi Creative Sensor Taiwan, Taipei City 1998
Visiera Technologies[238] Headquarters Phase I Taiwan, Hsinchu Science-based Industrial Park 2007, September CMOS Image Sensors
Kodenshi AUK Group[239] Silicon FAB Line
Kodenshi AUK Group[239] Compound FAB Line
Shindengen Electric Manufacturing[240] Philippines, Laguna
Shindengen Electric Manufacturing[240] Thailand, Lumphun
ABB[228] Czech Republic
Philips[241] Netherlands, Eindhoven 200,150 30,000 R&D, MEMS
nanoPHAB Netherlands, Eindhoven 50-100 10-50 2-10 MEMS

(NOTE: Some Fabs located in Asia don't use the number 4, or any 2 digit number that adds up to 4, because it is considered of bad luck.)

Closed[edit]

List of old fabs that closed:

Company Plant name Plant location Plant cost (in US$ billions) Started production Wafer size (in mm) Process technology node (in nm) Wafer production capacity/month Technology/products Ended production
EI Niš Ei Poluprovodnici Serbia, Niš 1962 100 2000
Fairchild Semiconductor (former National Semiconductor) West Jordan USA, UT, West Jordan 1977 150 2015[242]
NEC Livingston[243] Scotland, West Lothian, Livingston April 2001
Freescale Semiconductor Toulouse Fab[244] France, Toulouse 1969 150 650 2012[245]
Freescale Semiconductor Sendai Fab[246] Japan, Sendai 1987 150 500 ?
Hynix E-4 USA, OR, Eugene 1.3 2007 200 30,000 2008[247]
Intel Fab 8[10] Israel, Jerusalem 1985 150 Microprocessors, Chipsets, Microcontrollers[11] 2007
Intel Fab 17[1][2] USA, MA, Hudson 1998 200 130 Chipsets and other[3] 2014
LFoundry (de) (former Renesas Electronics)[248] Germany, Landshut ? 200 2011
LFoundry (de) (former Atmel)[249] France, Rousset ? 200 25.000[250] 2014
MOS Technology,
Commodore Semiconductor,
GMT Microelectronics
USA, PA, Audubon 1969
1976
1995
1000 1976
1992 [251]
2001
Texas Instruments HFAB USA, TX, Houston 1967 150 2013[252]
Texas Instruments (former National Semiconductor) Arlington USA, TX, Arlington 1985 150 2010
TowerJazz Fab 4[139] Japan, Nishiwaki City ? ?
Qimonda Richmond[253] USA, VA, Richmond 300 January, 2009
Toshiba Fab 1(at Yokkaichi Operations)[254] Japan, Yokkaichi 1992 September, 2001
TSMC Fab 1[49] Taiwan, Hsinchu 1987 20,000 March 9, 2001
Unknown(fortune 500 company) USA, East Coast[255] 150 1,600 MEMS 2016

See also[edit]

References[edit]

  1. ^ a b c d e f g h i j k l "Moore's Law Around the World, in Bricks and Mortar". 2010-10-21. Archived from the original on July 13, 2011. 
  2. ^ a b c d e f g h i j "Intel Global Manufacturing Facts" (PDF). Download.intel.com. Retrieved 2017-03-22. 
  3. ^ a b c d e f g h i j k "Intel Global Manufacturing Facts" (PDF). Download.intel.com. Retrieved 2017-03-22. 
  4. ^ "Intel Announces Multi-Billion-Dollar Investment in Next-Generation Manufacturing in U.S. | Intel Newsroom". Newsroom.intel.com. Retrieved 2017-03-22. 
  5. ^ https://www.extremetech.com/extreme/163372-atom-everywhere-intel-breaks-ground-on-first-450mm-fab
  6. ^ Pallatto, John. "Intels $3 Billion Fab Now Open for Business". Eweek.com. Retrieved 2017-03-22. 
  7. ^ "Intel to Invest More than $5 Billion to Build New Factory in Arizona | Intel Newsroom". Newsroom.intel.com. Retrieved 2017-03-22. 
  8. ^ Swartz, Jon (2011-03-29). "Intel's new $5 billion plant in Arizona has Obama's blessing". Usatoday.com. Retrieved 2011-03-28. 
  9. ^ "Intel and Trump Announce $7B for Fab 42 Targeting 7nm". HPCwire. 2017-02-08. Retrieved 2017-03-18. 
  10. ^ a b "Intel in Israel: A Old Relationship Faces New Criticism". Knowledge.wharton.upenn.edu. 2014-09-29. Retrieved 2017-03-22. 
  11. ^ a b "Intel Israel Fab Tour - The First Official Intel Press Event in Israel". Ixbtlabs.com. Retrieved 2017-03-22. 
  12. ^ "INTEL Ireland Fab 24 NOW Recruiting - CareersPortal.ie". www.careersportal.ie. Retrieved 2015-10-20. 
  13. ^ Pallatto, John. "Intel Opens $2.5 Billion Fab Plant in China". Eweek.com. Retrieved 2017-03-22. 
  14. ^ "Intel in Dalian, China". Intel.com. Retrieved 2016-08-04. 
  15. ^ "TowerJazz Completes Acquisition of Maxim’s Fabrication Facility in San Antonio, Texas" (PDF). towerjazz.com. 2016-02-02. Retrieved 2017-05-25. 
  16. ^ http://towerjazz.com/manufacturing.html
  17. ^ "Worldwide Locations - Maxim". Maximintegrated.com. 2016-08-22. Retrieved 2017-03-22. 
  18. ^ Apple buys former Maxim chip fab in North San Jose, neighboring Samsung Semiconductor; December 14, 2015.
  19. ^ "Worldwide Locations - Maxim". Maximintegrated.com. 2016-08-22. Retrieved 2017-03-22. 
  20. ^ "Vsp-mikron". Vsp-mikron. Retrieved 2017-03-22. 
  21. ^ Patricia A. Wilson (2010-07-22). Exports and Local Development: Mexico's New Maquiladoras. Books.google.com. p. 82. Retrieved 2017-03-22. 
  22. ^ http://hexus.net/business/news/components/107617-micron-dram-factory-mishap-taiwan-results-fab-suspension/
  23. ^ http://www.eetimes.com/document.asp?doc_id=1331980
  24. ^ a b Dave Morgan (2010-12-30). "Company Spotlight: Micron Technology, Inc.". SemiAccurate.com. Retrieved 2017-03-22. 
  25. ^ a b c Andrew Mierau. "Micron Technology, Inc. - Home | Memory and Storage Solutions". Micron.com. Retrieved 2017-03-22. 
  26. ^ "Micron Semiconductor Asia Pte. Ltd. - Singapore - Commercial & Industrial". Facebook. Retrieved 2017-03-22. 
  27. ^ "Security Check Required". Facebook. Retrieved 2017-03-22. 
  28. ^ "Micron Singapore. - Singapore - Electronics Company". Facebook. Retrieved 2017-03-22. 
  29. ^ "Micron Technology Completes Acquisition of Inotera Memories of Taiwan (NASDAQ:MU)". Investors.micron.com. Retrieved 2017-03-22. 
  30. ^ a b c "Archived copy". Archived from the original on 2015-05-02. Retrieved 2015-05-14. 
  31. ^ https://web.archive.org/web/20150503151756/http://globalfoundries.com:80/manufacturing/fab-8-overview
  32. ^ a b c d "Archived copy". Archived from the original on 2014-06-25. Retrieved 2014-08-06. 
  33. ^ https://www.toshiba.co.jp/about/press/2017_02/pr0901.htm
  34. ^ a b c http://www.toshiba.co.jp/about/ir/en/news/20170803_1.pdf
  35. ^ a b "Press Release (12 Jul, 2011): Toshiba and SanDisk Celebrate the Opening of Fab 5 300mm NAND Flash Memory Fabrication Facility in Japan". Toshiba.co.jp. 2011-07-12. Retrieved 2017-03-22. 
  36. ^ "Toshiba and SanDisk Celebrate the Opening of the Second Phase of Fab 5 and Start Construction of the New Fab 2 Semiconductor Fabrication Facility at Yokkaichi, Japan". Sandisk.com. Retrieved 2015-10-20. 
  37. ^ http://www.toshiba.co.jp/about/press/2004_04/pr1301.htm
  38. ^ http://www.toshiba.co.jp/about/press/2007_09/pr0401.htm
  39. ^ http://www.toshiba.co.jp/about/press/2006_05/pr3101.htm
  40. ^ http://www.toshiba.co.jp/about/press/2004_02/pr0201.htm
  41. ^ a b c http://www.toshiba.co.jp/about/press/2017_02/pr0901.htm
  42. ^ a b http://www.toshiba.co.jp/about/ir/en/news/20170628_3.pdf
  43. ^ http://www.toshiba.co.jp/about/press/2016_11/pr0801.htm
  44. ^ a b https://www.japantimes.co.jp/news/2017/08/04/business/corporate-business/toshiba-looks-build-new-yokkaichi-chip-plant-without-partner-western-digital-fueling-feud/#.Wb4d38jyjIU
  45. ^ https://www.toshiba.co.jp/about/press/2016_07/pr1501.htm
  46. ^ http://www.businesswire.com/news/home/20160715005186/en/Toshiba-Western-Digital-Celebrate-Opening-New-Fab
  47. ^ a b c http://www.hitachi-power-semiconductor-device.co.jp/en/company/access/index.html
  48. ^ "Fab Locations". Taiwan Semiconductor Manufacturing Company Limited. Retrieved 2012-04-21. 
  49. ^ a b http://www.eetimes.com/document.asp?doc_id=1143146
  50. ^ a b c d http://www.eetimes.com/document.asp?doc_id=1183723
  51. ^ http://www.eetimes.com/document.asp?doc_id=1189456
  52. ^ http://www.eetimes.com/document.asp?doc_id=1189456
  53. ^ a b http://www.tsmc.com/english/dedicatedFoundry/manufacturing/gigafab.htm
  54. ^ "TSMC Acquires PSC Land for New Fab Construction". Taiwan Economic News. 2011-01-13. Archived from the original on 2011-07-24. Retrieved 2011-01-13. 
  55. ^ Divide 2 million by 12, rounded
  56. ^ http://www.eetimes.com/document.asp?doc_id=1331928&page_number=11
  57. ^ http://www.eetimes.com/document.asp?doc_id=1183222
  58. ^ http://www.eetimes.com/document.asp?doc_id=1189323
  59. ^ http://www.eetimes.com/document.asp?doc_id=1124053
  60. ^ http://www.eetimes.com/document.asp?doc_id=1228739
  61. ^ http://www.eetimes.com/document.asp?doc_id=1183222
  62. ^ "Intel, Micron open US$3 billion NAND flash facility in Singapore". DigiTimes. 2011-04-11. Retrieved 2011-04-11. 
  63. ^ "Archived copy". Archived from the original on 2015-10-21. Retrieved 2015-07-21. 
  64. ^ "NXP Semiconductors | Automotive, Security, IoT". Freescale.com. Retrieved 2017-03-22. 
  65. ^ "Motorola Restarts MOS 12 Facility Expansion". Electronic News. 1999. Archived from the original on 2012-07-08. Retrieved 2011-10-06. 
  66. ^ "NXP Semiconductors | Automotive, Security, IoT". Freescale.com. Retrieved 2017-03-22. 
  67. ^ "R & D Collaboration on Trial: The Microelectronics and Computer Technology Corporation". Harvard Business School Press. 1994. Retrieved 2011-10-06. 
  68. ^ a b https://www.nexperia.com/about/worldwide-locations/manufacturing.html
  69. ^ http://www.eetimes.com/document.asp?doc_id=1330569
  70. ^ "LFoundry: New Frontiers, New Opportunities". Applied Materials. 2014-04-01. Retrieved 2017-03-22. 
  71. ^ The Singapore Research Story. Books.google.com. p. 120. Retrieved 2017-03-22. 
  72. ^ a b [1]
  73. ^ [2]
  74. ^ "Archived copy". Archived from the original on 2011-07-20. Retrieved 2011-05-27. 
  75. ^ a b c http://www.powerchip.com/en.php?node=about#contact-us
  76. ^ http://www.powerchip.com/en.php?node=services#manufacturing
  77. ^ http://www.powerchip.com/en.php?node=services#manufacturing
  78. ^ http://www.powerchip.com/en.php?node=services#manufacturing
  79. ^ a b c d e f g h "SMIC - Fab Information". Smics.com. Retrieved 2017-03-22. 
  80. ^ a b c d e f "SMIC Presentation" (PDF). www.smics.com. 2017-05-01. Retrieved 2017-06-22. 
  81. ^ a b c d "Much Ado About China’s Big IC Surge; EE Times". www.eetimes.com. 2017-06-22. Retrieved 2017-06-22. 
  82. ^ "Chinese semiconductor maker SMIC plans US$3.59 billion Beijing plant | South China Morning Post". Scmp.com. Retrieved 2017-03-22. 
  83. ^ http://www.eetimes.com/document.asp?doc_id=1331928&page_number=11
  84. ^ "Archived copy". Archived from the original on 2011-10-08. Retrieved 2011-05-27. 
  85. ^ http://www.winbond.com/hq/about-winbond/locations/index.html?__locale=en&type=1
  86. ^ http://www.jjpan.com/en/portfolio/ctsp-fab-winbond-electronics-corp/
  87. ^ [3][dead link]
  88. ^ "ProMOS Goes for 70nm DRAM". SOFTPEDIA. 2007-08-13. Retrieved 2011-05-27. 
  89. ^ "Record fab construction reached in second quarter, says report". EE Times. 2004-07-02. Retrieved 2011-05-31. 
  90. ^ Anderson, Mark. "Telefunken no more: Company changes name to TSI Semiconductors". Bizjournals.com. Sacramento Business Journal. Retrieved 2014-06-30. 
  91. ^ "Renesas sells U.S. fab to Telefunken". EE Times. 2011-03-30. Retrieved 2011-05-31. 
  92. ^ http://www.skhynix.com/eng/about/global.jsp
  93. ^ http://www.skhynix.com/eng/about/history2010.jsp
  94. ^ a b c https://www.skhynix.com/jpa/pr/pressReleaseView.do?seq=1966&offset=
  95. ^ "CSMC-About". Csmc.com.cn. Retrieved 2017-03-22. 
  96. ^ http://www.fujitsu.com/global/about/corporate/locations/worldlocation/japan/about_Mie.html
  97. ^ a b https://www.theregister.co.uk/2013/02/07/fujitsu_chip_spinoff_q3_financials/
  98. ^ http://www.eetimes.com/document.asp?doc_id=1326373
  99. ^ a b c http://www.fujitsu.com/jp/group/mifs/en/
  100. ^ a b c "Fujitsu to Construct New Fab for Logic Chips Employing 65nm Process Technology and 300mm Wafers - Fujitsu United States". Fujitsu.com. Retrieved 2017-03-22. 
  101. ^ a b c "Japan Plants - Fujitsu Global". Fujitsu.com. Retrieved 2017-03-22. 
  102. ^ http://www.eetimes.com/document.asp?doc_id=1326373
  103. ^ https://www.electronicsweekly.com/news/business/manufacturing/fujitsu-invests-in-65nm-fab-at-mie-2006-01/
  104. ^ http://www.eetimes.com/document.asp?doc_id=1326373&page_number=2
  105. ^ http://www.eetimes.com/document.asp?doc_id=1326373
  106. ^ http://www.eetimes.com/document.asp?doc_id=1326373&page_number=3
  107. ^ http://www.fujitsu.com/global/about/corporate/locations/worldlocation/japan/about_Suzaka.html
  108. ^ http://www.fujitsu.com/global/about/corporate/locations/worldlocation/japan/about_Iwate.html
  109. ^ http://www.fujitsu.com/jp/group/afsl/en/
  110. ^ http://www.fujitsu.com/global/about/corporate/locations/worldlocation/japan/about_Aizu.html
  111. ^ http://www.fujitsu.com/jp/group/afsl/en/business/
  112. ^ http://www.fujitsu.com/jp/group/fsl/en/resources/news/press-releases/2014/1201-1.html
  113. ^ https://www.micronas.com/en/news-events/trade-news/micronas-builds-second-fab-module-meet-market-demands-0007
  114. ^ https://www.micronas.com/en/company
  115. ^ "Manufacturing Facility in Oregon". Onsemi.com. Retrieved 2017-03-22. 
  116. ^ "Design & Manufacturing Center in Idaho". Onsemi.com. Retrieved 2017-03-22. 
  117. ^ "Archived copy". Archived from the original on 2011-06-20. Retrieved 2011-06-16. 
  118. ^ "Man ufacturing". Samsung. Retrieved 2017-08-10. 
  119. ^ a b c https://news.samsung.com/global/samsung-electronics-begins-mass-production-at-new-semiconductor-plant-in-pyeongtaek-south-korea
  120. ^ "Man ufacturing". Samsung. Retrieved 2017-06-22. 
  121. ^ http://www.eetimes.com/document.asp?doc_id=1326565
  122. ^ a b "Man ufacturing". Samsung. Retrieved 2017-08-22. 
  123. ^ http://www.secc.co.kr/eng/html/biz/biz_showing_view.asp?part=0001&idx=MzE5
  124. ^ http://www.businesswire.com/news/home/20050928006126/en/Samsung-Electronics-Launches-Second-Phase-Investment-Strategy-Hwaseong
  125. ^ http://www.samsung.com/semiconductor/about-us/factsheet/
  126. ^ http://www.anandtech.com/show/11603/samsungs-multibillion-fab-in-pyeongtaek-starts-volume-production-of-64layer-vnand
  127. ^ http://www.reuters.com/article/us-samsung-elec-investment-chips/samsung-electronics-makes-14-7-billion-bet-with-new-south-korean-chip-plant-idUSKCN0HV01R20141006
  128. ^ https://www.pcworld.com/article/2691992/samsung-to-invest-147-billion-in-new-fab.html
  129. ^ http://www.eetimes.com/document.asp?doc_id=1326565
  130. ^ https://www.bloomberg.com/news/features/2017-07-27/summer-of-samsung-a-corruption-scandal-a-political-firestorm-and-a-record-profit
  131. ^ https://www.androidheadlines.com/2017/04/samsung-nearly-finished-building-worlds-largest-factory.html
  132. ^ a b . Samsung http://www.samsung.com/semiconductor/about-us/location/. Retrieved 2017-08-22.  Missing or empty |title= (help)
  133. ^ "Samsung to spend $7 billion on wafer fab in Xian, China". EE Times. 2012-04-03. Retrieved 2017-06-22. 
  134. ^ "Samsung Puts 3D NAND Production Line in Xi'an into Full Operation". BusinessKorea. 2015-12-21. Retrieved 2017-06-22. 
  135. ^ a b c http://www.samsung.com/global/business/led/sales-network/salesnetwork-detail
  136. ^ a b c https://www.samsungdisplay.com/eng/intro/loc_country.jsp
  137. ^ https://www.samsungdisplay.com/eng/intro/history.jsp
  138. ^ a b c d e http://english.etnews.com/20170630200003
  139. ^ a b c d e f g "Manufacturing at TowerJazz". Towerjazz.com. Retrieved 2017-03-22. 
  140. ^ a b c https://tpsemico.com/manufacturing-facilities/
  141. ^ http://www.towerjazz.com/prs/2017/0821.html
  142. ^ http://www.eenewsanalog.com/news/tower-confirms-chinese-fab-project
  143. ^ "Infineon Technologies Austria AG" (PDF). Infineon.com. Retrieved 2017-03-22. 
  144. ^ "Infineon Technologies Dresden" (PDF). Infineon.com. Retrieved 2017-03-22. 
  145. ^ "Our Locations - Infineon Technologies". Infineon.com. Retrieved 2017-03-22. 
  146. ^ "Infineon launches Kulim fab". EE Times. Retrieved 2017-03-22. 
  147. ^ "Infineon Technologies Eckdaten Regensburg" (PDF). Infineon.com. Retrieved 2017-03-22. 
  148. ^ a b [4][dead link]
  149. ^ http://www.eenewsanalog.com/news/bosch-open-making-mems-others
  150. ^ a b c "Analog/Mixed-Signal Semiconductor Foundry: Germany (Headquarters) single". Xfab.com. Retrieved 2017-03-22. 
  151. ^ a b c "Analog/Mixed-Signal Semiconductor Foundry: Germany (Dresden) single". Xfab.com. Retrieved 2017-03-22. 
  152. ^ a b "Analog/Mixed-Signal Semiconductor Foundry: Germany (Itzehoe) single". Xfab.com. Retrieved 2017-03-22. 
  153. ^ a b c "Analog/Mixed-Signal Semiconductor Foundry: Malaysia single". Xfab.com. Retrieved 2017-03-22. 
  154. ^ a b c "Analog/Mixed-Signal Semiconductor Foundry: USA (Texas) single". Xfab.com. Retrieved 2017-03-22. 
  155. ^ "Archived copy". Archived from the original on 2014-01-19. Retrieved 2014-01-17. 
  156. ^ Luciana Magalhaes. "Corporación América Buying Batista's Stake in SIX: Argentine Firm Buying 33% Stake in SIX Semicondutores". The Wall Street Journal. 
  157. ^ "environmental sensors, light sensors, image sensors, audio sensors, optical sensors - sensing is life". Ams.com. 2017-03-16. Retrieved 2017-03-22. 
  158. ^ "Technology Overview" (PDF). Huahonggrace.comInfineon.com. Retrieved 2017-03-22. 
  159. ^ a b "ASMC". Asmcs.com. 2005-12-31. Retrieved 2017-03-22. 
  160. ^ "Shanghai Belling Co,Ltd". Belling.com.cn. Retrieved 2017-03-22. 
  161. ^ a b "Diodes Incorporated: Analog, Discrete, Logic, and Mixed-Signal ICs". Diodes.com. Retrieved 2017-03-22. 
  162. ^ a b "Polar Semiconductor, Inc - A Sanken Company". Polarsemi.com. Retrieved 2017-03-22. 
  163. ^ a b c d e f g https://www.sony-semiconductor.co.jp/company/kyoten
  164. ^ https://www.sony.net/SonyInfo/News/Press/201401/14-016E/
  165. ^ http://www.dualshockers.com/nintendo-and-the-wii-u-may-be-in-trouble-due-to-closure-of-vital-semiconductor-factory/
  166. ^ a b c d e f g https://www.renesas.com/en-us/about/company/profile/global.html
  167. ^ http://www.lginnotek.com/company/location_korea.jsp
  168. ^ a b c http://www.macronix.com/en-us/about/Pages/company-overview.aspx
  169. ^ http://www.nuvoton.com/hq/foundry-service/about-us/?__locale=en
  170. ^ a b http://www.mitsumi.co.jp/profile/history_e.html
  171. ^ http://www.eetimes.com/document.asp?doc_id=1326703
  172. ^ http://www.eetimes.com/document.asp?doc_id=1326703
  173. ^ a b http://www.kionix.com/about-kionix/company-profile
  174. ^ http://www.fujielectric.co.jp/fps/f_omachi.html
  175. ^ http://www.fujielectric.co.jp/fps/f_iiyama.html
  176. ^ http://www.fujielectric.co.jp/fps/f_hokuriku.html
  177. ^ http://www.fujielectric.co.jp/fps/f_main.html
  178. ^ http://www.murata.com/ja-jp/about/newsroom/news/company/general/2016/1006
  179. ^ a b http://www.murata.com/ja-jp/group/kanazawamurata/corporate/overview?intcid5=com_xxx_xxx_cmn_nv_xxx
  180. ^ http://www.murata.com/ja-jp/group/kanazawamurata/sendai?intcid5=com_xxx_xxx_cmn_nv_xxx
  181. ^ http://www.murata.com/ja-jp/group/kanazawamurata/products
  182. ^ http://www.murata.com/en-eu/about/company/muratalocations/japan/yasu/overview
  183. ^ https://www.olympus-global.com/company/base/office.html
  184. ^ http://www.semiconductor-technology.com/projects/olympus/
  185. ^ http://www.micronsemiconductor.co.uk/manufacture-facilities-with-static-header-3/
  186. ^ https://www.dwavesys.com/tutorials/background-reading-series/introduction-d-wave-quantum-hardware
  187. ^ a b https://www.dwavesys.com/our-company/meet-d-wave
  188. ^ a b http://www.mitsubishielectric.com/company/environment/business/semiconductor/index.html
  189. ^ a b http://www.mitsubishielectric.co.jp/corporate/gaiyo/network/randd/#area=09
  190. ^ http://www.mitsubishielectric.co.jp/corporate/gaiyo/network/randd/#area=06
  191. ^ http://www.mitsubishielectric.co.jp/corporate/gaiyo/network/randd/#area=06
  192. ^ http://www.mitsubishielectric.co.jp/corporate/gaiyo/network/randd/#area=06
  193. ^ http://www.sisemi.com.cn/en_contact.aspx?id=51
  194. ^ a b http://www.sisemi.com.cn/en_contact.aspx?id=248
  195. ^ http://www.eetimes.com/document.asp?doc_id=1331928&page_number=11
  196. ^ http://www.eetimes.com/document.asp?doc_id=1331928&page_number=11
  197. ^ http://www.hlmc.cn/en/AboutUs.aspx?id=227
  198. ^ http://www.hlmc.cn/en/AboutUs.aspx
  199. ^ http://www.eetimes.com/document.asp?doc_id=1331928&page_number=11
  200. ^ http://www.eetimes.com/document.asp?doc_id=1331928&page_number=11
  201. ^ http://www.eetimes.com/document.asp?doc_id=1331928&page_number=11
  202. ^ http://www.eetimes.com/document.asp?doc_id=1331928&page_number=11
  203. ^ http://www.eetimes.com/document.asp?doc_id=1331928&page_number=11
  204. ^ http://www.eetimes.com/document.asp?doc_id=1331928&page_number=11
  205. ^ http://www.eetimes.com/document.asp?doc_id=1331928&page_number=11
  206. ^ http://www.eetimes.com/document.asp?doc_id=1331928&page_number=11
  207. ^ https://careers-cree.icims.com/jobs/4802/process-engineer-sustaining%2c-etch/job
  208. ^ https://careers-cree.icims.com/jobs/5094/product-engineer-manufacturing/job/
  209. ^ http://www.eetimes.com/document.asp?doc_id=1127768
  210. ^ https://www.bizjournals.com/sacramento/stories/2010/03/22/story6.html
  211. ^ https://www.cnet.com/news/short-take-nec-announces-1-4b-chip-plant-for-roseville-california/
  212. ^ http://denso-europe.com/denso-to-build-a-new-plant-at-denso-iwate-location/
  213. ^ https://www.denso.com/global/en/news/news-releases/2017/20170329-g01/
  214. ^ https://www.just-auto.com/news/denso-to-expand-iwate-plant-to-produce-instrument-clusters_id175718.aspx
  215. ^ https://spectrum.ieee.org/tech-talk/computing/software/rigetti-launches-fullstack-quantum-computing-service-and-quantum-ic-fab
  216. ^ https://www.wired.com/story/quantum-computing-factory-taking-on-google-ibm/
  217. ^ http://www.prnewswire.com/news-releases/rigetti-computing-named-to-mit-technology-reviews-annual-50-smartest-companies-list-300480401.html
  218. ^ http://www.flir.com/cores/display/?id=51883
  219. ^ http://www.njr.com/corporate/support/index.html
  220. ^ http://www.njr.com/corporate/support/google_kawagoe.html
  221. ^ a b http://www.njr.com/products/foundry/index.html
  222. ^ http://www.njr.com/corporate/group/index.html
  223. ^ http://www.njr.com/products/device/saw_foundry/index.html
  224. ^ http://www.njr.com/corporate/group/index.html
  225. ^ http://www.njrf.co.jp/company/index.html
  226. ^ http://www.njr.com/corporate/associated_companies.html
  227. ^ http://www.njr.com/corporate/associated_companies.html
  228. ^ a b http://www.abb.com/cawp/seitp202/afc715ad6054256fc12577150041249b.aspx
  229. ^ a b http://www.semi.org/en/node/47621
  230. ^ http://www.noeltech.com/facilities
  231. ^ http://www.noeltech.com/advanced-Lithography-Services.htm
  232. ^ a b c d e http://www.skyworksinc.com/aboutlocations.aspx
  233. ^ a b c http://www3.sii.co.jp/en/semicon/corp/base/
  234. ^ a b c http://optoelectronics.liteon.com/en-global/world/worldwide-contact
  235. ^ a b c d e http://www.liteon-semi.com/_en/10_company/02_about.php?ID=3
  236. ^ a b c http://www.csi-sensor.com.tw/eng/about.aspx
  237. ^ http://www.jjpan.com/en/portfolio/factory-headquarters-nanchang-creative-sensor-technology/
  238. ^ http://www.jjpan.com/en/portfolio/headquarters-phase-i-visera-technologies-co-ltd/
  239. ^ a b http://www.kodenshiauk.com/About/NetworkFactory
  240. ^ a b http://www.shindengen.co.jp/company_e/network_f.html
  241. ^ http://www.eenewsanalog.com/news/philips-plans-double-size-mems-foundry
  242. ^ Harry, Stevens. "Fairchild Semiconductor to close Utah facility amid job cuts". The Salt Lake Tribune. Retrieved October 17, 2016. 
  243. ^ http://www.eetimes.com/document.asp?doc_id=1204576
  244. ^ "NXP Semiconductors | Automotive, Security, IoT". Freescale.com. Retrieved 2017-03-22. 
  245. ^ "Freescale closes French fab". EE Times. Retrieved 2017-03-22. 
  246. ^ "NXP Semiconductors | Automotive, Security, IoT". Freescale.com. Retrieved 2017-03-22. 
  247. ^ "Hynix will close 200mm fab in Oregon | EE Times". EETimes. Retrieved 2017-06-20. 
  248. ^ "Lfoundry continues based on Rousset fab". EE Times. 1999-02-22. Retrieved 2017-03-22. 
  249. ^ Peter Clarke (2014-01-02). "Lfoundry Rousset fab closes with loss of 600 jobs". Electronics EETimes. Retrieved 2017-03-22. 
  250. ^ Peter Clarke (2014-01-02). "Lfoundry Rousset fab closes with loss of 600 jobs". Electronics EETimes. Retrieved 2017-03-22. 
  251. ^ Superfund Site: COMMODORE SEMICONDUCTOR GROUP LOWER PROVIDENCE TOWNSHIP, PA
  252. ^ "Texas Instruments News Center - News Releases". Newscenter.ti.com. Retrieved 2017-03-22. 
  253. ^ http://www.datacenterknowledge.com/archives/2010/04/05/qts-plans-huge-virginia-data-center
  254. ^ http://www.toshiba.co.jp/about/press/2001_08/pr0801.htm
  255. ^ http://www.eenewsanalog.com/news/mems-wafer-fab-contents-sale-5-million-ono

External links[edit]